Shin-Etsu G751 Thermal Compound 1 GRAM

Shin-Etsu G751 Thermal Compound

This thermal interface compound is developed by Shin Etsu Chemical Co., Ltd. to meet the current and future requirements of high performance microprocessors. It is used to increase surface contact area for heat transfer by minimizing any air bubbles that exists between the top of the processor and the base of the heat sink. 

Features

• Injector with cap for easy application and storage
• 1gm syringe
• Thermal Conductivity 4.63 W/m K
• Electrically non-conductive

Please note: Syringes are marked in cubic centimeters which is a measure of volume not weight.