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Shin-Etsu G751 Thermal Compound 1 GRAM

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Code: 50111
Our Price: $8.99
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Shin-Etsu G751 Thermal Compound

This thermal interface compound is developed by Shin Etsu Chemical Co., Ltd. to meet the current and future requirements of high performance microprocessors. It is used to increase surface contact area for heat transfer by minimizing any air bubbles that exists between the top of the processor and the base of the heat sink. 

Features

  • Injector with cap for easy application and storage
  • 1gm syringe
  • Thermal Conductivity 4.63 W/m K
  • Electrically non-conductive

Please note: Syringes are marked in cubic centimeters which is a measure of volume not weight.



Customer Reviews

2nd best thermal compound in the world 06/22/2007 - by Anonymous from unspecified
OEM's such as Intel, HP & Dell have known for years that G-751 has been the TIM (thermal interface material) of choice, and it is only because of Wizard (of IP, Tweakers Australia and OCWizard fame) that ShinEtsu products became available to the individual overclocking enthusiast market.
ShinEtsu G-751 normally takes 72hrs to cure, using a 24/7 burn-in for best effect. The compound has the consistency of plumbers putty, and may be difficult to utilize for novices. However, please note that G-751 is not nearly as difficult to work with as Coollaboratory's liquid Gallium/Indium solution.
Despite a widespread (yet uninformed) opinion, ShinEtsu G-751 is actually superior to Arctic Silver V in CPU cooling performance. The only TIM that beats ShinEtsu G-751 in performance is Coollaboratory's Liquid Pro.
Since Liquid Pro cannot be used on aluminum, G-751 is simply the best choice for when using an aluminum HSF.
The OEM manufacturers have known this for years, and now you do too.
Copyright CrazyPC 2006, 2007

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