Shin-Etsu G751 Thermal Compound
This thermal interface compound is developed by Shin Etsu Chemical Co., Ltd. to meet the current and future requirements of high performance microprocessors. It is used to increase surface contact area for heat transfer by minimizing any air bubbles that exists between the top of the processor and the base of the heat sink.
Features
Please note: Syringes are marked in cubic centimeters which is a measure of volume not weight.