Shin-Etsu X23-7762 Thermal Compound 1 Gram

Shin-Etsu X23-7762 Thermal Compound (Model X23-7762) - This thermal interface compound is developed by Shin Etsu Chemical Co., Ltd. to meet the current and future requirements of high performance microprocessors. It is used to increase surface contact area for heat transfer by minimizing any air bubbles that exists between the top of the processor and the base of the heat sink. 

Features

• High performance thermal grease. Good for general applications. More forgiving in situations where the heatsink block is not a perfect finish.
• Injector with cap for easy application and storage
• 1gm syringe (comes in 1cc syringe)
• Thermal Conductivity: 6.0 (W/m K)
• Electrically non-conductive
• Viscosity: (Pa.s @ 25C) 180
• Storage Conditions 60 F to 85 F (15 C - 29 C)