Arctic Silver 5 Thermal Compound 12grams

Arctic Silver 5 Thermal Compound 12grams - Arctic Silver 5 provides a new level of performance due to it's unique high-density filling of micronized silver and enhanced thermally conductive ceramic particles.  Arctic Silver 5 is optimized for use between modern high-power CPUs and high performance heatsinks or water-cooling solutions.

Due to the unique shape and sizes of the particles in Arctic Silver 5's conductive matrix, it will take a up to 200 hours to achieve maximum particle to particle thermal conduction and for the heatsink to CPU interface to reach maximum conductivity. (This period will be longer in a system without a fan on the heatsink or with a low speed fan on the heatsink.) The CPU's temperature will drop as much as 2C to 5C over this "break-in" period. This break-in will occur during the normal use of the computer.

Arctic Silver 5 features:

• Arctic Silver 5 Thermal Compound - Comes in a 12gram Syringe
• Made with 99.9% pure silver.
  Arctic Silver 5 uses three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact area and thermal transfer.
• Over 88% silver content by weight.
  In addition to micronized silver, Arctic Silver 5 also contains sub-micron zinc oxide, aluminum oxide and boron nitride particles. These thermally-enhanced ceramic particles improve the compound's performance and long-term stability.
• Extended temperature limits:   – 50C to >180C
  Arctic Silver 5 will not run or separate.
• Controlled Tripple-Phase Viscosity.
  Arctic Silver 5 does not contain any silicone. The suspension fluid is a proprietary mixture of advanced polysynthetic oils that work together to provide three distinctive functional phases. As it comes from the tube, Arctic Silver 5's consistency is engineered for easy application. During the CPU's initial use, the compound thins out to enhance the filling of the microscopic valleys and ensure the best physical contact between the heatsink and the CPU core. Then the compound thickens slightly over the next 50 to 200 hours of use to its final consistency designed for long-term stability.
  (This should not be confused with conventional phase change pads that are pre-attached to many heatsinks. Those pads melt each time they get hot then re-solidify when they cool. The viscosity changes that Arctic Silver 5 goes through are much more subtle and ultimately much more effective.)
• Thermal conductivity:  >300,000W/m² C (0.001 inch layer)
• Thermal Resistance:  <0.005C-in²/Watt (0.001 inch layer)
• 3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
• Negligible electrical conductivity. 
  Arctic Silver 5 was formulated to conduct heat, not electricity.
  (While much safer than electrically conductive silver and copper greases, Arctic Silver 5 should be kept away from electrical traces, pins, and leads. The compound is slightly capacitive and could potentially cause problems if it bridged two close-proximity electrical paths.)

Reviews

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Application Instructions

    1.Even though Arctic Silver is specifically engineered for high electrical
       resistance, you should keep the compound away from processor, memory,
       and motherboard  traces and pins. There is a possibility that dust or metal
       particles and/or shavings carried by the airflow inside the computer case
       could contaminate the compound and increase its electrical conductivity.

    2.ONLY Arctic Silver should be between the processor core and the heatsink.
       Remove any thermal pads or other interface material from the heatsink
       before applying the Arctic Silver.

    3.Clean the mating surfaces completely with a low residual solvent (isopropyl
       alcohol will work) and a LINT FREE cloth. (i.e. lens cleaning cloth) If the
       heatsink surface has had thermal compound previously applied, the surface
       should be thoroughly scrubbed and cleaned with a quality degreaser
       (Available at automotive stores.) and then followed with the alcohol cleaning
       step. It is important to keep the surfaces free of foreign materials and NOT to
       touch the surfaces (a hair, piece of lint, and even dead skin cells can
       significantly affect the thermal interfaces performance, especially on modern
       small core CPUs as the surface area is already severely limited). In addition,
       oils from your fingers can adversely affect the performance by preventing
       the micronized silver fill from directly contacting the metal surface. (Finger
       prints can be as thick as 0.005")

    4.Apply the thermal compound to the SMALLER of the two mating surfaces in
       the appropriate thickness. The flatter the mating surfaces, the thinner the
       layer that is required. Properly lapped processors and heatsinks will only
       require a translucent haze on top of the core of the chip. Stock unlapped
       processors and/or heatsinks with surface irregularities or that are concave
       or convex  will require a thicker layer to fill the resultant gaps. DO NOT use
       your finger to apply or smooth the compound (skin cells, and oils again). A
       razor blade or the clean edge of a credit card can be used as the application
       tool. You may use whatever tool you choose as long as it is CLEAN and
       allows you to control the application area and thickness.

    5.RECHECK to make sure no foreign contaminants are present on either
       surface, and assemble the two surfaces.

    6.PRESS the two surfaces together ONLY. Minimize any "twisting" or lateral
       "sliding" in either plane in an attempt to mate the "peaks" of the surfaces
       together. When you twist or slide one surface against the other, "peaks" on
       one or both surfaces will travel over areas where two "valleys" should come
       to rest. The peaks will scrape away compound that is needed to fill the void
       between the valleys that will oppose each other when the surfaces are in
       their final position and cause small voids (air gaps). ANY air gap will
       significantly increase thermal resistance in an otherwise GOOD interface. If
       the thermal compound is properly made and of the proper consistency,
       direct non-sliding pressure vertical to the mating plane will be more than
       enough to insure that the surfaces "bottom out". Additionally, "sliding" the
       surfaces together may cause one surface to scratch/gouge the other
       possibly opening up a larger inter-surface gap which will increase thermal
       resistance.