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Enerdyne Indigo Xtreme (IX) Engineered Thermal Interface 775-X1

Quantity in Basket:none
Code: indigo-xtreme-50130LGA775
Regular Price: $19.99
Sale Price: $19.95
Stock: IN STOCK

Quantity:

Indigo Xtreme (IX) Engineered Thermal Interface 775-X1 represents a whole new approach to high-performance CPU cooling. IX is a precision Engineered Thermal Interface (ETI) that keeps CPUs a stunning 2-4C cooler than the highest performance greases or metallic thermal interface materials (TIMs) available today.

Its innovative and patent-pending structure deploys a highly conductive Phase Change Metal Alloy (PCMA) into all the surface micro-asperities on the CPU lid and heat sink, resulting in the lowest resistance heat path. Unlike messy greases and liquid metal interface products, IX is a self-contained and sealed structure, automatically deploying the correct amount of PCMA every time.

Based upon technology for high heat flux electronics, IX sets the new standard for thermal interface performance within the PC enthusiast community. No mere TIM can compete with Indigo Xtreme’s performance.


Features

  • Indigo Xtreme (IX) Engineered Thermal Interface 775-X1 for Intel Core 2 LGA775 Socket Processors
  • Includes TWO (2) ETIs (2 applications)
  • Lowest overall thermal resistance of any TIM available today
  • No cure time
  • Most consistent performance - automatically applies the correct amount of alloy
  • Fully compatible with all surfaces, including copper and aluminum
  • Fully sealed structure - no mess or migration
  • Easy clean-up – just peel to remove
  • Laser-cut precision

Specifications

  • Gallium-free phase change metal alloy
  • Bulk Thermal Conductivity: >20 W/mK
  • Thermal Impedance: 0.04�C-cm2/W
Contents
Your Precision-Engineered Thermal Interface Kit includes everything needed for two complete installations:
  • Indigo Xtreme ETIs (2 installations)
  • Nitrile gloves (1 set)
  • Solvent wiper pouches (2)
  • Cleanroom-grade dry wipes (2)
  • Detailed installation instructions

Note: Not for use with direct heat pipe or heatsinks with a small base that does not make full contact with CPU Core.



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