The Arctic Silver Matrix Thixotropic Thermal
Compound 2.5g MTX-2.5G with its unique high-density
filling of micronized Zinc Oxide, Aluminum Oxide, and Aluminum particles in
silicone base oil that forms a thermal conductive Martix. The Matrix provides a new level of performance and stability. The
Arctic Silver Matrix has been tested and found to be 2 to 12 degrees better than standard thermal compounds or thermal pads.
Due to the unique carrier fluid used and
the shapes and sizes of the thermally conductive particles in Matrix, it will
take a minimum of 300 hours and multiple thermal cycles to achieve maximum
particle to particle thermal conduction and for the heatsink to CPU interface to
reach maximum conductivity. (This period will be longer in a system without a
fan on the heatsink.) On systems measuring actual internal core temperatures via
the CPU's internal diode, the measured temperature will often drop significantly
over this "break-in" period. This break-in will occur during the normal use of
the computer as long as the computer is turned off from time to time and the
interface is allowed to cool to room temperature. Once the break-in is complete,
the computer can be left on if desired.
Arctic Silver Matrix features:
- Matrix Thixotropic Premium Thermal Compound - Comes in a
2.5gram Syringe
- Thermal Matrix: The unique blend of micronized
Zinc Oxide, Aluminum Oxide, and Aluminum particles in a silicone base oil,
that forms a thermal conductive matrix, that provides class-leading
performance and exceptional long-term stability.
- Performance Attributes: Matrix’s silicone
suspension fluid and conductive fillers are engineered for easy application
and superior surface wetting. This enhances performance in moderate bond
line applications and offers better performance in large gap situations than
other Arctic Silver retail market compounds. During initial use, Matrix wets
the thermal surfaces and fills the microscopic voids and valleys. With time,
pressure, heat and vibration, Matrix achieves superior thermal contact
between the surfaces.
- Electrical Insulator: Matrix is not
electrically conductive.
- Performance: 2 to 12 degrees Celsius lower CPU
full load core temperatures than standard thermal compounds or thermal pads
when measured with a calibrated thermal diode imbedded in the hottest
section of the CPU core.
- Temperature Limits: -50 to 135 degrees Celsius
- Average Particle Size: 7.8 microns 0.00031
inch
- Coverage Area: One tube will cover
approximately 20 square inches.
- RoHS compliant
Application
Instructions
1.Even
though Arctic Silver is specifically engineered for high electrical
resistance, you should keep the compound away from processor, memory,
and motherboard traces and pins. There is a possibility that dust
or metal
particles and/or shavings carried by the airflow inside the computer case
could contaminate the compound and increase its electrical conductivity.
2.ONLY
Arctic Silver should be between the processor core and the heatsink.
Remove any thermal pads or other interface material from the heatsink
before applying the Arctic Silver.
3.Clean
the mating surfaces completely with a low residual solvent (isopropyl
alcohol will work) and a LINT FREE cloth. (i.e. lens cleaning cloth) If
the
heatsink surface has had thermal compound previously applied, the surface
should be thoroughly scrubbed and cleaned with a quality degreaser
(Available at automotive stores.) and then followed with the alcohol cleaning
step. It is important to keep the surfaces free of foreign materials and
NOT to
touch the surfaces (a hair, piece of lint, and even dead skin cells can
significantly affect the thermal interfaces performance, especially on
modern
small core CPUs as the surface area is already severely limited). In addition,
oils from your fingers can adversely affect the performance by preventing
the micronized silver fill from directly contacting the metal surface.
(Finger
prints can be as thick as 0.005")
4.Apply
the thermal compound to the SMALLER of the two mating surfaces in
the appropriate thickness. The flatter the mating surfaces, the thinner
the
layer that is required. Properly lapped processors and heatsinks will only
require a translucent haze on top of the core of the chip. Stock unlapped
processors and/or heatsinks with surface irregularities or that are concave
or convex will require a thicker layer to fill the resultant gaps.
DO NOT use
your finger to apply or smooth the compound (skin cells, and oils again).
A
razor blade or the clean edge of a credit card can be used as the application
tool. You may use whatever tool you choose as long as it is CLEAN and
allows you to control the application area and thickness.
5.RECHECK
to make sure no foreign contaminants are present on either
surface, and assemble the two surfaces.
6.PRESS
the two surfaces together ONLY. Minimize any "twisting" or lateral
"sliding" in either plane in an attempt to mate the "peaks" of the surfaces
together. When you twist or slide one surface against the other, "peaks"
on
one or both surfaces will travel over areas where two "valleys" should
come
to rest. The peaks will scrape away compound that is needed to fill the
void
between the valleys that will oppose each other when the surfaces are in
their final position and cause small voids (air gaps). ANY air gap will
significantly increase thermal resistance in an otherwise GOOD interface.
If
the thermal compound is properly made and of the proper consistency,
direct non-sliding pressure vertical to the mating plane will be more than
enough to insure that the surfaces "bottom out". Additionally, "sliding"
the
surfaces together may cause one surface to scratch/gouge the other
possibly opening up a larger inter-surface gap which will increase thermal
resistance.
7.Secure
the thermal interface with the supplied clips or other hardware.
